Abstract
The Laser-Induced Forward Transfer (LIFT) process is a modified, conventional LIFT technology where a polymer coating layer of a transparent substrate is used to transform the laser energy into kinetic energy in order to transfer the deposited target material. Micropatterning is achieved by scanning the laser beam and translating the acceptor substrate. In this study, a modified process based on LIFT is proposed. This process has been applied to micropatterning and electric circuit printing technology. The proposed technology introduces a polymer coating layer on the transparent substrate for the LIFT process. The proposed LIFT technology facilitates fabrication of conductive micropatterns with accurate geometry by creating electric circuits with improved conducting performance. Modification of the LIFT process is discussed, and the properties of the fabricated material are measured and compared to those of a material obtained with the conventional LIFT method.
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