Abstract
AbstractAromatic polyimide film composed of biphenyl tetracarboxylic acid dianhydride (BPDA) and p‐phenylene diamine (PDA) is a very stable polymer at high temperatures and very useful for the electronics industry. Bonding properties were improved by corona discharge treatment of this film. The chemical modification method was applied for generated functional groups, that is, carboxylic, hydroxyl, and amino groups in the gas phase, and the quantity of these functional groups was determined by X‐ray photoelectron spectroscopy. The functional groups increased with corona energy, leveling off at a specific corona energy. The bond strength of the copper foil/adhesive/polyimide film was determined. The relationship between bond strength and functional group content was analyzed by multivariate analysis. Bond strength could be sufficiently correlated with functional group quantity. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 3403–3408, 2006
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