Improvement of a High-Current-Density Power Backplane Design With a PID Fan Control Cooling System on an Enterprise Server

Abstract

Power consumption saving and direct airflow to enhance a system’s cooling efficiency are important for the per watt index performance both of a server system and a data center’s application. In this research project, we design the high-current-density power distribution printed circuit board (PCB) as an enterprise server power backplane board. This project also includes a design of both the vent hole size and the location to distribute the direct current path not only to attain a satisfactory loading balance but also to obtain the necessary direct airflow to improve cooling efficiency. In addition, we design the proportional–integral–derivative (PID) control module as a universal management control module for an enterprise server as a rack system assembly, in order to control the fan speed duty cycle more efficiently, all of which depends on a temperature that is different from the present error, the accumulation of past errors, and the prediction of future errors. We also consider the server system airflow impedance and fan speed duty and their dependence on other items, to ensure that the airflow is controllable and to prevent not only interference but also noise between enterprise server systems.