Improvement in wettability of pressure‐sensitive adhesive on silicon wafer using crosslinking agent with siloxane groups

Abstract

AbstractAcrylic copolymers are prepared by radical polymerization of 2‐ethylhexyl acrylate, ethyl acrylate, and acrylic acid followed by crosslinking to manufacture the pressure‐sensitive adhesives (PSAs) for silicon wafer protection. Both higher reliability and wettability are required for the protective acrylic PSAs in the semiconductor processing applications. The siloxane linkages are introduced in the acrylic PSAs via crosslinking with siloxane‐containing crosslinking agent to modify the thermal and wetting properties of PSAs efficiently. The more efficient formation of crosslinked network structure was achieved with higher content of tetra‐functional crosslinking agent, and the surface energy of PSAs decreased significantly with increasing the content of siloxane linkage resulting in the improved areal wetting rate. The thermal stability of PSAs was also improved significantly by incorporation of siloxane linkages. The adhesion properties such as peel strength and probe tack of acrylic PSAs decreased significantly by increasing the content of either crosslinking agent or siloxane linkage. The acrylic PSA with siloxane group showed both satisfactory wetting and clean debonding properties for the optimal protection of thin silicon wafers. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013