Abstract
In the present study, a monocrystalline silicon (Si) wafer was treated by ultrasonic nanocrystal surface modification (UNSM) to enhance the efficiency and service life of Si-based devices by reducing reflectivity and improving surface properties, respectively. Microstructure, surface reflection, surface free energy and dry tribological characteristics of Si wafer before and after UNSM were systematically investigated. A silicon nitride (Si3N4) ball with a diameter of 5 mm was used as a counterface. The wear resistance was enhanced by 23% after UNSM in comparison with that of the as-received Si wafer. The reduction in reflectivity is due to roughened surface, while the improvement in tribological characteristics due to the strengthening. Thus, it is recommended that a UNSM can be potentially used as an alternative mechanical surface treatment for thin Si wafers.
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