Abstract
Electrochemical Spark Machining (ECSM) is applicable to machine the materials which are non-conducting. The present research work extended the application area of ECSM process from non-conducting materials to semiconducting materials i.e. silicon carbide (SiC). In order to enhance material removal rate (MRR) and to reduce the entrance oversize (OS) as well as surface roughness (SR), the magneto-hydrodynamic (MHD) convection approach is utilized. The magnetic field (MF) produces Lorentz forces during electrolysis process. This MF assisted travelling-wire electrochemical spark machining (TW-ECSM) process provides better flushing in narrow gap between work material and tool electrode by clearing the zone from debris particles to obtain a stable spark. It is evident from results that presence of magnetic field improved MRR from 19.15% to 200% and reduced SR and OS from 16.86% to 48.58% and from 11.37% to 21.27% respectively.
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