Abstract
The density of defects in the buried oxide of implanted oxide silicon-on-insulator material which cause low resistance paths between the substrate and top silicon layer has been greatly reduced by high temperature oxidation. The mechanism for this is the diffusion of oxygen through the top silicon layer to the buried oxide, where it oxidizes chains of silicon atoms.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Paper version not known
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
