Abstract
This work investigates the effect of graphene filler in epoxy resin with the purpose of developing an improved thermally conductive epoxy encapsulation material for electronic devices. The findings in this work show that the thermal conductivity increases by a factor of about 1.6 times with 0.1 wt% loading of graphene in epoxy resin. The increase in the rate of surface charge verifies an improved anti-static property. On examining the phase resolved partial discharge patterns, it is observed that the inception voltage and the number of partial discharge pulses is lower for the filled epoxy compared to that of the neat epoxy. The increase in the rate of surface charge decay indicates an improved anti-static property. The findings in this paper provide a reference in the development of materials with improved thermal conductivity and anti-static properties for graphene/epoxy materials for use in the packaging of electronic devices.
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