Abstract

We report improved thermoelectric performance of Cu2O-Cr/Sn composite powder by using a simple fabrication approach. Thermoelectric properties of pure Cu2O and Cu2O-Cr/Sn powder pellets are characterized in the temperature range of 300–400 K, where large amount of low-grade waste heat exists. We simply fabricate specimen through pressing powders intentionally without sintering. Seebeck coefficient about 1400 μV/K of pure Cu2O powder pellets was obtained, much higher than earlier reported value (700 μV/K). In addition, mixing Cu2O with Cr or Sn powder effectively increased the electrical conductivity, therefore the maximum power factor reached 0.1 μW·m−1 K−2 for Cu2O-Cr (mole ratio at 10:1) in contrast to pure Cu2O of ~0.05 μW·m−1 K−2. Improved thermoelectric performance by adding of Cr or Sn metal powder is thought to be due to remote doping, energy band bending, energy filtering effect and high electronic DOS (Density of States) at the interface. Our results show the potential application of Cu2O-Cr composite powder for thermoelectric devices. This simple fabrication process could possibly be applied to other thermoelectric systems.

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