Abstract
The surface and texture properties of Ag(Cu) alloy thin films on indium tin oxide (ITO) has been investigated and compared to pure Ag thin films on ITO. Atomic force microscopy (AFM) and x-ray diffraction results of annealed films show differences in the evolution of surface morphology and texture with annealing. The presence of Cu atoms in the silver alters the alloy’s surface energy and surface diffusion. This results in Ag and Ag(Cu) alloy having the very different surface morphology and crystallographic texture. The (111) texture of the Ag(Cu) is enhanced when compared to that of pure Ag films. The resistivity of Ag(Cu) films annealed at high temperatures (∼up to 600°C for 1h in vacuum) remained constant due to absence of agglomeration.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.