Abstract

Multifunctional LiNbO3 material plays an important role in domain wall microelectronics and nonlinear optoelectronics. However, the material is hard and relatively inert, and hence is quite difficultly etched. A new oblique method to etch LiNbO3 memory cells at the surface of X-cut bulk crystals was proposed in this study. The process includes mask fabrication, oblique etching, and wet corrosion cleaning. The etching angle highly approaches 83° to achieve better polarization retention than others with etching angles of 0° and 70°. Meantime, the measured domain switching hysteresis loops become more symmetrical along the voltage axis than others with the presence of a strong imprint field. The horizontal electric field simulation along the polar Z axis exhibits the enhanced nucleating fields of the domains located at two edges of each memory cell in contact to Pt electrodes under the same applied voltage. The depolarization field was better screened in the memory with a higher etching angle. The new oblique method can improve the performance of the ferroelectric domain wall memory significantly.

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