Improved Performance and Bias Stability of Al2O3/IZO Thin-Film Transistors with Vertical Diffusion

Abstract

Several studies on amorphous oxide semiconductor thin-film transistors (TFTs) applicable to next-generation display devices have been conducted. To improve the poor switching characteristics and gate bias stability of co-sputtered aluminum–indium–zinc oxide (AIZO) TFTs, we fabricate Al2O3/indium–zinc oxide (IZO) dual-active-layer TFTs. By varying the Al2O3 target power and oxygen partial pressure in the chamber during Al2O3 back-channel deposition, we optimize the electrical characteristics and gate bias stability of the Al2O3/IZO TFTs. The Al2O3/IZO TFTs, which are fabricated under 50 W Al2O3 target power and 13% oxygen partial pressure conditions, exhibit a high electron mobility of 23.34 cm2/V·s, a low threshold voltage of 0.96 V, an improved on–off current ratio of 6.8 × 107, and a subthreshold swing of 0.61 V/dec. Moreover, by increasing the oxygen partial pressure in the chamber, the positive and negative bias stress values improve to +0.32 V and −2.08 V, respectively. X-ray photoelectron spectroscopy is performed to reveal the cause of these improvements.