Improved Modeling of Material Deposition during OLED Manufacturing Using Direct Simulation Monte Carlo Method on GPU Architecture

Abstract

A direct simulation Monte Carlo (DSMC) method is implemented on graphical processing unit (GPU) architecture to simulate the deposition phenomena that occur on a glass panel during modern organic light emitting diodes (OLED) manufacturing processes with a huge number of simulated particles because a fully three-dimensional (3D) particle simulation is required to accurately predict deposition thickness and uniformity on the substrate in a low-pressure environment. To examine the accuracy and efficiency of the newly developed DSMC code running on GPU architecture, verification and validation tests were performed by solving several benchmarking problems. Under three conditions which have been applied in previous OLED deposition process test experiments, the new DSMC model successfully simulates the transport of organic material evaporated from the heated nozzle array and its deposition onto a glass panel inside a low-pressure chamber. The uniformity and normalized thickness between the DSMC and experimental results for the three test cases are then compared. The normalized thickness of the organic material deposited to the large glass panel calculated from the DSMC is found to have an error of less than 4%, and the uniformity values calculated from the absolute deposition thickness show good agreement with those obtained from experimental data in all test cases.