Abstract
N-type independent gate FinFETs (IGFinFETs) have been fabricated and characterized. Previous published results for this structure highlighted processing deficiencies. Several process enhancements have improved device results beyond those previously reported. These process improvements are presented, and the resulting device is demonstrated. Device results for 2 micron channel length devices are shown. Six decades of drain current suppression and low gate leakage currents are achieved. Subthreshold slope of 200 mV/dec and a threshold voltage tuning range of 1.7 V are demonstrated. This device combines the behavioral characteristics of independent-double-gate MOSFETs with the processing advantages and integration of FinFETs.
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