Improved electrical performance of MOCVD-grown GaN p-i-n diodes with high-low junction p-layers

Abstract

We report that using a high/low p-type junction anode structure results in improved hole injection over a uniformly-doped p-anode layer in GaN pin junction diodes. Quasi-vertical diodes with a 20 nm thick, magnesium concentration of 2 × 1020 cm−3 layer on top of a 480 nm thick layer with a magnesium concentration of 1018 cm−3 show greatly increased forward current density – >100× higher – than those with a 500 nm thick uniformly 3 × 1019 cm−3 Mg-doped p-layer. Forward knee voltage and ideality factor are reduced by a factor of more than two, and reverse leakage current density is also reduced. Additionally, the specific differential series resistance is reduced significantly. With photoluminescence measurements, we found that these improvements are largely due to improved p-GaN material quality of the high/low junction sample with lower average Mg concentration.