Improved dielectric and breakdown traits of polymer composites filled with KH-550 encapsulated multilayer black phosphorus

Abstract

Polymer/particles composites are attractive for dielectric energy-storage, but they express difficultly-reconcilable conflict in high dielectric constant and breakdown strength. Here, multilayer black phosphorus (BP) coated by γ-aminopropyl triethoxysilane (KH-550) as filler, and poly(vinylidene fluoride-trifluoroethylene-chlorofluoroethylene) (P(VDF-TrFE-CFE)) as matrix were used to prepare composite films. KH-550 encapsulation enhances BP/matrix interfacial compatibility. Dielectric constant of polymer/BP@KH-550 composite is ∼207 at 20 Hz when filler load is 10 wt% (dielectric loss ∼0.11), combined with direct-current breakdown strength of ∼288 MV m−1. This work is beneficial to facile preparation of dielectric composites with well-balanced dielectric and breakdown properties for capacitive energy-storage.