Abstract

This article details a method for improving the consistency of bond-line thickness during lap-shear sample preparation. This includes the schematic for a lap-shear sample test rig and consideration for controlled variation of the bond-line thickness for up to ten pairs of samples at a time. Concerns regarding the curing of the samples when held on a large heat reservoir are addressed through direct measurement of the bond-rig temperature in combination with the cure chamber temperature. Additionally, the application of a release coating to the bond-rig has been demonstrated to improve ease of sample removal for the bond-rig, minimizing potential damage to the lap-shear sample set before testing. The release coating provides a clean surface for subsequent sets of samples, ensuring an even surface and reducing cleaning and degradation of the machined geometries of the rig. Overall, the proposed bond-rig provides:•Increased bond-line uniformity•Up to ten samples prepared in a batch•Option to apply a release coating to improve usability and minimize cleaning

Highlights

  • The SLJ test configuration is often criticized due to the number of setup parameters that can negatively affect the consistency of the test results unless controlled

  • A bond-rig was designed which was able to accommodate ten bonded lap shear samples per test

  • The design ensured that the fillet at the edge of the adhesive joint are the same dimensions from batch-to-batch ensuring that the geometric parameters that may influence bond strength of each bonded sample are kept consistent. `As can be seen from the CAD model of the new bond-rig in Fig. 1, the bond overlap length was controlled at 12.7 mm as per ASTM D1002-10 [3]

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Summary

Method Article

Improved consistency of bond-line thickness when conducting single lap-shear joint tests. Joe Flanagana,*, Lorcan Byrneb, Joseph Mohanb, Barry Twomeyb, Kenneth T. Stantona a School of Mechanical & Materials Engineering, University College Dublin, Belfield, Dublin 4, Ireland b ENBIO Ltd., DCU Alpha Innovation Campus, Glasnevin, Dublin 11, Ireland

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