Improved adhesion of polyurethane-based coatings to tin surface

Abstract

Polyurethane (PU)—based conformal coatings which protect electronic components and boards from harsh environmental exposures were further developed to mitigate the tin (Sn) whisker growth in lead (Pb)—free electronics. As a means of achieving this goal, the adhesion mechanics of PU-based conformal coating on tin surfaces was investigated. We attempted to improve the interfacial adhesion between PU-based conformal coatings and tin (Sn) as it slows down the formation of tin whisker growth. A multi-layer sandwiched specimen made between two Si beams was employed to create an interface between PU coating and Sn for four-point bending testing (4PBT). The result shows that PU has strong adhesion to Sn while polyurethane acrylate (PUA) has much weaker adhesion to Sn. The PUA adhesion, however, increased by introducing a silane agent ((3-Aminopropyl)triethoxysilane) on the tin surface, which is covalently bonded to PUA. The adhesion improvement of a modified tin surface was also confirmed by a simple cross-cut tape peeling test. Post fracture analysis suggested that blocking the reaction between bare Sn surface and the acrylate component contribute to improved adhesion.