Imprint lithography for flexible transparent plastic substrates

Abstract

A novel imprinting process has been developed for the use of resist pattern transfer on flexible transparent plastic substrates. The polymer resist was first spin-coated on the mold, which was treated with a release agent. After softbaking, the resist layer was attached to a plastic substrate coated with an adhesive. The patterns were completely transferred to the substrate after removing the mold. Using this method, we were able to obtain the desired patterns on the plastic substrate without heating the substrate, which could deform the substrate.