Abstract
This paper deals with a viscoplastic potential-based model allowing thermomechanical damage behavior modeling of porous materials. The model describes rate dependent effects, hardening, creep as well as defects coalescence and propagation. Kinematic and isotropic hardening effects are taken into account by a set of internal state variables. The integration and implementation of the model into the FE code using a fully implicit integration scheme is exposed. Finally, it's used to predict mechanical behaviour degradation of solder layers used in power electronic packaging. Stress-strain behaviour and the evolution of volumic fraction of voids for the material under cyclic loading are presented.
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