Abstract
Next generation electronics should be implementation on heterogeneous integration between sensor device with micro controller unit (MCU). Towards to robustness and high sensing performance, hybrid flexible printed electronic (HFPE) technology becoming an alternative for sensor fabrication compared to conventional silicon semiconductor processing photolithography technique. Thus in this paper, formulation on stretchable conductive ink (SCI) by implementing polydimethylsiloxane (PDMS) as a binder mixed with silver (Ag) flake was characterized. Resistance average between 0.6 – 98.9 with strecthability from 0% to 90%. Fabricated strechtable based temperature sensor showed the resistivity of circuit trace was average 0.7–1.6 Ohm.μm. This paper showed the capability implementation SCI as a circuit trace and heteregenously integration with multiple rigid components such as micro controller unit IC, LED IC, temperature sensor and cable connector as a simple temperature circuit system on TPU substrate.
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