Implementation of three-dimensional bandpass frequency selective structure using multilayer PCB technology

Abstract

A new three-dimensional (3D) frequency selective structure (FSS) with bandpass filtering response is presented. The proposed FSS, modified from a microstrip line based bandpass FSS, is implemented by using multilayer PCB technology, which indicates that this structure can be easily fabricated with high accuracy and should be more suitable for high frequency applications. The design concept and operating principle are briefly described and explained. Simulated results demonstrate that the FSS exhibits dual polarization, high out-of-band rejection, and stable frequency response under a large variation of incident angle.