Implementation of the pin-in-paste process in a contract manufacturing environment

Abstract

The pin-in-paste process was developed and validated for a contract manufacturing PCB assembly environment. A systematic approach was used to implement this process in a production environment. The sequence used for process development included solder paste volume calculations for through hole components (THCs), stencil aperture design for the pin-in-paste application, solder paste deposition through stencil printing, reflow profile development, inspection, and testing. A series of experiments were conducted to identify the 'process window' associated with each process step. The required volume of solder paste was computed using a set of empirical equations. The stencil printing process was 'optimized' using a 'design of experiments' based approach. Response surfaces were plotted and used to identify the 'optimal' print parameters. Thermal profiles were developed for reflow soldering the THCs in conjunction with the surface mount components (SMCs) in a single reflow pass. The assemblies were built using the 'optimized' process parameters. The assemblies were then inspected under an X-ray system to check for solder voiding. Electrical testing was then done to check for solder shorts and open connections. The shape of the solder joints was similar to a wave soldered joint, voiding was minimal, and there was no instance of solder shorts or an open connection. The solder joints were then cross-sectioned as a part of destructive testing. The cross sections showed the formation of good positive fillets (both top and bottom fillet), the solder paste had filled the plated through hole (PTH) completely, and voiding was minimal.