Abstract
For pt.I, see ibid., vol.I, no., p.429-35 (2004). Impingement air cooling with heat sinks is one attractive solution in thermal management of electronic components. A simple impingement flow thermal resistance model based on developing laminar flow in rectangular channels is proposed. Experimental measurements of thermal resistance are performed with heat sinks of various impingement inlet widths, fin spacings, fin heights and airflow velocities to test the validity of the model. The accuracy of the predicted thermal resistance was found to be within 20% of the experimental data at channel Reynolds numbers less than 1200. The simple model is suitable for parametric design studies.
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