Impacts of using discrete and continuous porous layers on the cooling performance of confined multiple slot jet impingement under partially active magnetic field

Abstract

PurposeThe purpose of this study is to examine the effects of using discrete and continuous porous layers on the convective heat transfer improvement for multiple slot jet impingement onto a flat surface under magnetic field.Design/methodology/approachIn the domains which are separated by the porous layers, uniform magnetic field with different strengths is used and as the solution technique finite element method is used. The numerical study is conducted considering different values of parameters: Reynolds number (250–1000), strength of magnetic field in different domains (Hartmann number between 0 and 20), permeability of discrete or continuous layers (Darcy number between 105 and 102) and number of layers in discrete case (2–10). Artificial neural network is used for performance estimation of systems equipped with different types of porous layers.FindingsIt is observed that significant differences occur in the local Nu between the discrete and continuous layer case, especially at lower Re, while peak Nu value is 77% higher in discrete layer configurations as compared to continuous one at Re = 250. Upper domain magnetic field results in average Nu enhancement, while the trend is opposite for the lower domain magnetic field strength. The increment amount becomes 10%, while the reduction amount is obtained as 38% at the highest magnetic field strengths. The permeability of layers in both cases and number of layers in discrete porous layer case provide effective solution for the cooling performance control. A modeling approach based on artificial neural networks provides fast thermal performance estimations of multiple impinging jets equipped with discrete and continuous porous layers.Originality/valueOutcomes of the study are useful in development and optimization of new cooling systems in many thermal engineering systems encountered in photovoltaic panels, micro-electro-mechanical systems, metal processing and many others.