Abstract
Recycling and reuse of wood-based panels has been attracting great attention since it is an environmentally friendly means of managing wood waste. The recycled wood-based panels usually still contain adhesive residue. In the current research, the impact of urea-formaldehyde (UF) resin, one of the most widely used adhesives, on recycling and reconstitution of wood-based products has been evaluated by adding cured UF resin particles into a new adhesive system. The morphology, chemical structure, curing behavior, and bonding quality of an adhesive system containing 0–6% previously cured resin particles of varied sizes (< 600μm) were investigated and compared to those properties of a regular adhesive without any impurity. Three-ply plywood glued with a UF adhesive containing 0–10wt% previously cured resin of varied particle sizes (< 600μm) were prepared and characterized. The results indicated that the resin residue could significantly affect the curing behavior and bonding quality of the new adhesive system. Higher content and greater size of the particles caused more severe deterioration in the bonding strength.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
