Abstract
In failure analysis laboratory, infrared laser stimulation techniques are more and more used for performing accurate defect localization on IC surface. Signatures obtained on metallic elements are well known, but weak data are available on signatures of semiconductors elements. Our investigations consist of studying impact of semiconductors materials on IR Laser Stimulation signal during a failure analysis. Frontside and backside Thermal Laser Stimulation (TLS) experiments were performed on n+/p+ diffusion and polycrystalline resistors from 0.18 μm technology, both silicided (CoSi 2) and unsilicided. Experimental results are presented and discussed for different W/L ratios. The impact of different semiconductors materials on TLS measurements is discussed and verified by experiment.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
