Abstract

Lasers are frequently used to locally open dielectric layers for contacting the front or rear side of advanced silicon wafer solar cell architectures. For reasons of cost, laser processes are usually carried out in ambient environment, which inevitably leads to the oxidation of silicon. In order to achieve maximum solar cell efficiency, the laser processing has to be optimized thoroughly. The current research only focuses on minimizing laser-induced defects in silicon. However, our investigation shows another side effect of laser ablation, i.e., laser-induced oxidation, which is often neglected and undesirable for the subsequent metallization process. In this paper, we investigated the impact of laser-induced oxidation, which is caused by laser ablation in air, on the performance of silicon wafer solar cells. We show that by applying a postlaser etching step, laser-induced defects and oxide film can be removed effectively, providing improved conditions for the subsequent metallization process.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.