Abstract
Many electronics products are used in humid environments. High humidity in combination with various contaminants will affect the surface insulation resistance on printed board assemblies and may cause current leakage or in worse case short circuit due to electrochemical migration. This chapter discusses the failure mechanism for electrochemical migration and how it is affected by common contaminants on assemblies. Test methods for measuring surface insulation resistance and for assessing the risk for electrochemical migration are reviewed, and their relevance is discussed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
