Abstract
This paper focuses on a novel class of interconnect material employed in integrated circuits at nanotechnology nodes called as mixed CNT (carbon nanotube) bundle structures. These mixed bundle structures are formed by changing different positions of multi-wall and double-wall CNTs. The impact of temperature on the performance of global interconnects and the effect of undesirable functional crosstalk is also presented in detail. Crosstalk has been studied by performing transient analysis of MDCB (multi-walled CNT and double-walled CNT bundles) structures to evaluate their performance in relation with signal functionality.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
