Impact of functional crosstalk on mixed CNT bundles for future VLSI nodes

Abstract

This paper focuses on a novel class of interconnect material employed in integrated circuits at nanotechnology nodes called as mixed CNT (carbon nanotube) bundle structures. These mixed bundle structures are formed by changing different positions of multi-wall and double-wall CNTs. The impact of temperature on the performance of global interconnects and the effect of undesirable functional crosstalk is also presented in detail. Crosstalk has been studied by performing transient analysis of MDCB (multi-walled CNT and double-walled CNT bundles) structures to evaluate their performance in relation with signal functionality.