Abstract

Recent experimental measurements have shown that in GaAs with elevated threading dislocation densities (TDDs) the electron lifetime is much lower than the hole lifetime [C. L. Andre, J. J. Boeckl, D. M. Wilt, A. J. Pitera, M. L. Lee, E. A. Fitzgerald, B. M. Keyes, and S. A. Ringel, Appl. Phys. Lett. 84, 3884 (2004)]. This lower electron lifetime suggests an increase in depletion region recombination and thus in the reverse saturation current (J0 for an n+∕p diode compared with a p+∕n diode at a given TDD. To confirm this, GaAs diodes of both polarities were grown on compositionally graded Ge∕Si1−xGex∕Si (SiGe) substrates with a TDD of 1×106cm−2. It is shown that the ratio of measured J0 values is consistent with the inverse ratio of the expected lifetimes. Using a TDD-dependent lifetime in solar cell current–voltage models we found that the Voc, for a given short-circuit current, also exhibits a poorer TDD tolerance for GaAs n+∕p solar cells compared with GaAs p+∕n solar cells. Experimentally, the open-circuit voltage (Voc) for the n+∕p GaAs solar cell grown on a SiGe substrate with a TDD of ∼1×106cm−2 was ∼880mV which was significantly lower than the ∼980mV measured for a p+∕n GaAs solar cell grown on SiGe at the same TDD and was consistent with the solar cell modeling results reported in this paper. We conclude that p+∕n polarity GaAs junctions demonstrate superior dislocation tolerance than n+∕p configured GaAs junctions, which is important for optimization of lattice-mismatched III–V devices.

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