Abstract
Electrical performances of ultra-short channel MOSFETs were investigated on SOI substrates. The channel length was scaled to 3 nm using the anisotropic wet etching technique. A difficulty of junction technology was solved by fabrication of Junctionless-FET, which consists of uniform high concentration dopants through the body of device. Superior Junctionless-FET performance was confirmed when the channel thickness and gate dielectric film thickness were scaled close to 1 nm. Experimental and simulation studies suggest that variation of performance originates from atomic-scale fluctuation in device structures.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
