Abstract
Epoxy resins with acidic compounds feature adhesion, robustness, and deoxidizing ability. In this study, hybrid adhesive films with deoxidizing and curing capabilities for semiconductor packaging were fabricated. The compatibilizing effects and mechanical properties were chiefly investigated by using various additive binders (thermoplastic amorphous polymers) and compatibilizing agents. The curing, deoxidizing, thermal, and rheological properties were systematically investigated. For uniform film formation and maximizing deoxidizing curable abilities, a thermoplastic–thermoset mixture containing a phenyl and carboxylic acid-based additive (benzoic acid), and a polycarbonate was chosen as the model adhesive film. Without either a phenyl or an acidic group in the compatibilizing agent, deoxidizing and compatibilizing effects were not achieved. The manufactured hybrid adhesive film can be effectively used, especially for electronic devices that require deoxidization and adhesion.
Highlights
Epoxy resins have been widely utilized in a myriad of applications, such as electronic and semiconductor packaging, owing to their excellent adhesion to various substrates, and their mechanical and thermal properties [1,2,3]
They have been used as structural adhesives for epoxy molding compounds (EMCs) which protect semiconductor chips from external environmental factors, such as impact, pressure, moisture, heat, and ultraviolet rays [4,5]
Hybrid adhesive film composed of the primary epoxy binder, amine curing agent, and phenoxy matrix improved both its shear strength and toughness
Summary
Epoxy resins have been widely utilized in a myriad of applications, such as electronic and semiconductor packaging, owing to their excellent adhesion to various substrates, and their mechanical and thermal properties [1,2,3]. The metal solders are melted and wetted, thereby creating an electrical path between the chips and substrates [11]. Amino and acidic moieties, organoamine hydrochlorides, rosin-based fluxes, and inorganic acids in the state-of-the-art adhesives (known as no-flow underfill or fluxing underfill) remove the oxidizing layer of the metal pad (electrode) on the chips or substrates, thereby leading to the electrical interconnection via a melting and wetting of solders at elevated temperatures. The films were melted and the metal oxidized layers were removed at elevated temperatures to induce electrical interconnections. Impact modifiers and compatibilizers were utilized to enhance the mechanical properties of functional adhesive films
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