Abstract
Positive charge formation and its possible relationship to impact ionization in silicon dioxide have been controversial issues for many years. In this study, band-gap ionization due to the development of a high-energy tail in the hot-electron energy distribution is shown to occur in films thicker than 20.0 nm at fields higher than 7 MV/cm. This process is demonstrated to ‘‘directly’’ account for hole currents in the substrate circuit of n-channel field-effect transistors and for the observation of positively trapped charges accumulating at the substrate-silicon/silicon-dioxide interface at low injected-carrier fluences (less than 0.001 C/cm2) before the onset of trap creation.
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