Abstract
Abstract We are investigating fluidized beds of particles as a heat transfer medium for cooling electronic equipment. These fluidized beds share several of the attractive qualities of dielectric liquids but employ air rather than liquids in their operation. Experiments in cooling electronic circuit boards by directly immersing them in fluidized beds of dielectric particles have been performed. Heat dissipation from a simulated 20-pin flat pack in this fluidized environment was a factor of eight greater than forced convection without particles. In designs where heat conduction from the component to the circuit board is severely limited, enhancements approaching a factor of 50 are expected.
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