IMC and creep behavior in Lead-free solder joints of Sn-Ag and Sn-Ag-Cu alloy system by SP method

Abstract

The creep properties of Lead-free solder joints were evaluated by Shear Punch (SP) method. Lead-free solder joints with Sn-4Ag, Sn-4Ag-0.5Cu and Sn-4Ag-1.0Cu solder tested and compared to the lead solder joint with Sn-37Pb. SP creep tests were performed at temperature of 30, 50 and 80°C. For the SP method, constant shear stresses from 3 to 22 MPa were applied into the SP specimen(10 × 10 × 0.5 mm). From the SEM, IMC layer of Cu6Sn5 were observed on the interface between solder and Cu. From the SEM and EDX, the Lead-free solder joints have much thicker interfacial IMC layer than the Sn-37Pb solder joint. From the power law relationships, the Lead-free solder joints show superior creep resistance than the Sn-37Pb solder joint. And among Lead-free solder joints, at 30 and 50°C, the ternary SnAgCu solder joints have high creep resistance than the binary SnAg solder joint. Sn-4Ag-1.0Cu solder joint shows the best creep resistance at 30°C, and Sn-4Ag-0.5Cu solder joint shows the best creep resistance at 50°C. However, at high temperature 80°C, all of the Lead-free solder joints have similar creep properties. The activation energy were expressed with creep strain rate and temperature. The ternary SnAgCu solder joints have the higher activation energy than the binary SnAg solder joint at 17.68 and 18.72 MPa. Average activation energy of Lead-free solder joints were lower than that of Sn-37Pb 75.11 kJ/mol. The average activation energy of Sn-4Ag-1.0Cu, Sn-4Ag-0.5Cu and Sn-4Ag solder joint at high stress is 102.68, 62.52 and 58.61 kJ/mol, respectively.