Abstract
We have developed an image reversal photoresist with high thermal stability and electric insulating properties for small molecule organic light-emitting diode (SMOLED) applications. The thermal stability and electric insulating properties were investigated and compared to those of the conventional insulation layer and cathode separator materials of SMOLEDs. Moreover, to verify its applicability and reliability, 1.17″ 96 × RGB (red, green, and blue subpixels) × 96 passive matrix SMOLEDs were fabricated using the image reversal photoresist. This image reversal photoresist makes a single isolation structure, where the insulation layer and cathode separators of SMOLEDs are simultaneously formed by a single layer of image reversal photoresist, applicable to SMOLEDs, thereby reducing the fabrication processes and cutting down the manufacturing cost.
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