Abstract

We have demonstrated high performance operation of planar-type tunnel field-effect transistors (TFETs) using Ge/ III–V materials. Tensile strain in Si channels combined with the Ge source can enhance the tunneling current because of the reduced effective bandgap. The fabricated Ge/sSOI (1.1 %) TFETs show high I on /I off ratio over 107 and steep minimum subthreshold slope (SS) of 28 mV/dec. It is found that I on and SS are improved by positive back bias. We have also demonstrated the operation of high I on /I off and low SS planar-type InGaAs Tunnel FETs with Zn-diffused source junctions. Solid-phase Zn diffusion can realize steep-profile and defect-less p+/n source junctions. The small S.S. of 64 mV/dec and large I on /I off ratio over 106 have been realized in the planar-type III–V TFETs.

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