Abstract
IGBT (Insulated Gate Bipolar Transistor) power semiconductor modules become of importance for traction applications. However, the reliability of these power modules is still a concern, compared to those of press-packed GTOs. Although first IGBT-press-pack solutions have been presented to the market, IGBT-presspacking remains difficult and expensive. Besides this, customers prefer module technology solutions, because of their economical advantage and easiness of device mounting. Reliability tests have been developed and modules have been analyzed to judge critical reliability points and to show ways for improvement.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
