Abstract
This paper presents an understanding of a new mechanism of void formation in an epoxy-amine underfill system resulting only from interaction of the underfill with a decomposition product of the residual chip attach flux formed during package assembly. This is possible since flux residues have been known to sometimes be retained between the die and substrate even after the deflux process. Differential scanning calorimetry (DSC) was used extensively to study the thermal properties of both flux and underfill and to simulate the heating processes that these materials undergo at assembly. Thermal gravimetric analysis (TGA) was used to confirm the mechanism. This study does not make any attempt to explain the other effects contributed by equipment, bump pitch, filler size or any mechanical aspect on the voiding process.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
