Abstract
We investigated the effect of channel hot carrier (CHC) stressing on the creation of gate oxide defect centers causing random telegraph signals (RTSs) in pMOSFETs. To identify these stress-induced hole traps in the oxide and fully characterize their trapping properties, variable temperature RTS measurements were performed from room temperature down to 215 K and repeated after each stressing interval, up to 1200 s. The trapping properties of the stress-induced defect sites and those present before stress are quantified, including the hole capture and emission activation energies, structural relaxation in the oxide network due to trapping/detrapping, and entropy change as well as the energy level and position of the trap in the oxide. Based on this information, disassociated III-Si and hydrogen bridge defects are identified as the hole trapping centers in SiO2. Difference was observed between the process- and stress-induced traps in the entropy change upon hole emission from the oxide trap to Si channel (electron capture from the Si valence band), implying the possibility of stress-induced structural defects being different than the native ones.
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