Abstract

Ultrasonic infrared thermography is a novel nondestructive detection technique, which combines a short ultrasonic pulse excitation and infrared imaging to detect defects, such as crack, in materials and structures. A simplified one-dimension heat-conduction model excited by ultrasonic pulses is put forward in this paper. Based on this model, a serial of image processing methods for recognition and reconstruction of cracks were presented. Results obtained show that the proposed method is creditable and applicable.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.