Abstract

Ideal Sensor Chips —A Smart Microsensor Chip with LSI and MEMS Process and Materials—

Highlights

  • IntroductionSince 1979, Professor Nakamura and a semiconductor device research group including me, in Toyohashi University of Technology (founded by the government in 1976), attempted to establish an ideal integrated circuit (IC) facility from the design to IC processes (bipolar and MOS) for evaluation

  • Since 1979, Professor Nakamura and a semiconductor device research group including me, in Toyohashi University of Technology, attempted to establish an ideal integrated circuit (IC) facility from the design to IC processes for evaluation

  • Researchers including students can fabricate their own devices by themselves, which could lead to the production of original prototype devices using special processes and materials together with the CMOS process

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Summary

Introduction

Since 1979, Professor Nakamura and a semiconductor device research group including me, in Toyohashi University of Technology (founded by the government in 1976), attempted to establish an ideal integrated circuit (IC) facility from the design to IC processes (bipolar and MOS) for evaluation. The thicknesses of mouse layers 1 and 2/3 are about 100 and 200–300 μm, respectively, eliminating the possibility of signal detection from mouse layer 4 These results indicate that the Toyohashi probes can penetrate, are very low invasive electrodes, and enable a long stable recording, which result in the possibility of detecting signals immediately after needle penetration

Smart Microsensing Chips
Ion Image Sensors
Findings
Conclusions
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