Abstract
Infrared Components Corporation (ICC) recently announced that the company had acquired rights to uncooled microbolometer technology developed at the Defence Science and Technology Organization (DSTO), Australia. Under the license agreement DSTO is developing a technology transfer package for implementation in a silicon MEMS foundry. ICC has contracted Electro-optic Sensor Design (EOSD) for FPA design and analysis and local co-ordination of the technology transfer program. ICC has also entered into an agreement with SUNY Albany Center for Advanced Thin Film Technology (ACATFT) to transition the DSTO technology to production. In this paper we outline the microbolometer processing technology and discuss the aims and objectives of the ICC program.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
