Abstract
The recent introduction of IC technologies offering high frequency transistors withft greater than 10 GHz has opened new opportunities for higher integration of wireless communication systems. Fast silicon IC devices make possible the integration of many RF subsystems on a single die and offer a total solution to mixed frequency (low frequency and RF) and mixed signal (analog and digital) systems. This paper describes IC implementation challenges of a 2.4 GHz wireless LAN chipset developed at Harris Semiconductor.
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