Abstract
This paper presents the application of the new Image-Based Inertial Impact (IBII) test methodology to study the high strain rate response of adhesives. It relies on an inertial impact (spalling-like) test configuration and the use of ultra-high speed imaging to record the deformation of the test specimen in the MHz range. The underlying novelty is to use the acceleration obtained from the time-resolved displacement maps to derive stress information leading to the identification of the material constitutive parameters. Here, an epoxy adhesive is tested at strain rates up to 1000 s−1 and its modulus and tensile strength are successfully derived from just the deformed images.
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