Abstract
Most designs for a microelectronic implant require an encapsulant of some kind. The working life of a device, when implanted, depends upon sustained adhesion, in the presence of body fluid, between the encapsulant and the underlying structure encapsulated. This paper describes a series of accelerated life test on the adhesion between a convenient silicone rubber (Dow Corning 3140) and a range of adherend materials of which such structures might be made. It appears that bonding is by chemisorption and varies in resistance to degradation in water according to the density of negative charge on the adherend surface. The work is thought to provide the beginnings of a rational process for choosing adherend materials in implant design.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
