Hydrothermal performance analysis of microchannel heat sink with embedded module with ribs and pin-fins

Abstract

A new microchannel heat sink with embedded modules with ribs and pin-fins is proposed as an effective solution to realize microchannel heat dissipation within low-temperature co-fired ceramic substrates. Enhance heat dissipation with the following strategies: 1. microchannel cooling within the low-temperature co-fired ceramic substrate to shorten the heat transfer path; 2. embedding embedded modules in the substrate to reduce the overall thermal resistance; 3. creating ribs and pin-fins on the embedded modules to enhance convective heat transfer. The impacts of relative rib height, relative pin-fin height, and relative number of auxiliary channels on the heat transfer performance, temperature uniformity, and pressure drop were investigated. The performance of the proposed design has been compared to the performance of similar designs like straight rectangular microchannels, microchannels with pin-fins embedded modules, and microchannels with ribs embedded modules. Under the condition of Reynolds number 458, the heat transfer performance is improved by 63.91%, the temperature uniformity is improved by 67.65% and the pressure drop is increased by only 10.24%. The heat transfer performance of the microchannel heat sink with embedded modules with ribs and pin-fins can be effectively improved by adjusting the height of the pin-fins and the ribs height on the embedded module.