Hydrophobic Poplar Prepared via High Voltage Electric Field (HVEF) with Copper as Electrode Plate

Abstract

In order to improve hydrophobic characteristics which will affect the service performance of fast-growing poplar due to growing bacteria in the humid environment. In this study, a simple method was proposed to treat poplar via the high voltage electric field (HVEF) with copper as the electrode plate. Scanning electron microscope (SEM), Fourier transforms infrared spectroscopy (FTIR), X-ray diffraction (XRD) and contact angle tester were adopted to evaluate the surface morphology, surface group of poplar, crystallinity and wettability under HVEF. It was found by SEM that a large number of copper particles were uniformly attached to the surface of poplar. In all three sections, the weight percentage of the Cu element was accounting for more than half. The diffraction peaks of copper-containing compounds appeared in the (XRD). FTIR analysis confirmed that the reaction between copper and poplar took place. The surface contact angle of three sections of poplar increased in the following order: cross section < radial section < tangential section (increased by 34°, 45° and 53°, respectively). An environmentfriendly and efficient method of HVEF treating fast-growing wood with copper as the electrode plate can promote its outdoor application.