Hydrometallurgical recovery of silver and gold from waste printed circuit boards and treatment of the wastewater in a biofilm reactor: An integrated pilot application

Abstract

A hydrometallurgical process for the recovery of gold and silver from waste printed circuit boards (PCBs) was experimentally verified and tested at pilot scale. The process comprises four sequential leaching stages; the first two based on HCl, correspond to base metals (e.g. Sn, Cu) removal, while the third is based on HNO3 for Ag leaching and the final on aqua regia for Au leaching. After base metals leaching, the solid residue, enriched in silver and gold about 5 times, contained silver almost quantitively as insoluble AgCl and significant losses (Ag loss <8%) were avoided. The necessary reduction of Ag in the solid phase was achieved with a solution of 0.5 M N2H4 and 3 M NaOH, at 80 °C and S/L ratio 10%. Leaching of silver by 4 M HNO3 was followed by its recovery from nitrate solution by 0.08 Μ N2H4 at ambient temperature with an efficiency of 83%. Gold was leached by aqua regia and quantitively recovered by 0.13 M N2H4 at ambient temperature. Wastewater resulting from the process, rich in nitrate (5 g/L) and chloride (50 g/L), was treated by an effective and novel biological denitrification system tolerating metals at ppm level, to comply with zero nitrate and residual metals discharge guidelines. The overall process requires low reagents and energy input and has zero discharge for liquid effluents. The scheme is appropriate to be applied at local small to medium industrial units, complying with decentralized circular economy principles for metal recovery from electronic waste.